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Soder-Wick No Clean Desoldering Braid
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Soder-Wick No Clean Desoldering Braid
Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.
Related Content: Desoldering Braid Tips & Tricks (Video and Article)
- Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Patented noncorrosive, halide free, organic no-clean flux
- Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
- Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
Applications
- Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
- BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Specifications
- MIL-F-14256 F
- NASA-STD-8739.3 Soldered Electrical Connections
- DOD-STD-883E, Method 2022
- ANSI/IPC J STD-004, Type ROL0
- Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
- Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit
| Specifications | MIL-F-14256F, Type R NASA-STD-8739.3 DOD-STD-883E, Method 2022 ANSI/IPC J STD-004, Type ROL0 Bellcore TR-NWT-000078 ANSI/IPC J SF-818 MIL-STD-2000A MIL-B-81705C MIL-STD-1686C MIL-HDBK-263B |
|---|---|
| Shelf Life | 2 Yrs |
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