Heat sink compounds maximize heat transfer between circuit components and heat sinks without electrical conductivity. Heat sink compound is used to fill the gap between the CPU (central processing unit) or other heat generating components and the mechanical heat sink. The mechanical heat sink, a passive component made of a conductive metal, is placed over the CPU. Heat is drawn through the mechanical heat sink to its fins, where a fan blows air through to dissipate the excess heat.
Inefficiencies in the thermal transfer occur because two flat surfaces, e.g. CPU and mechanical heat sink, never join together perfectly. Inevitably there is an air gap because of imperfect surfaces. Because air is a relatively bad thermal conductor, this can lead to a reduction in heat dissipation, and as a result, an overheating and failing device. Heat sink compound is used to fill that gap and is designed to efficiently transfer the heat from the heat generating component to the heat dissipating device. Although the heat sink compound does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness.
CircuitWorks® brand’s comprehensive line of conveniently packaged and precision dispensing rework and repair products makes circuit board repair and prototyping faster, easier and more accurate. Advanced-formula materials packaged in unique delivery systems ensure superior performance and pinpoint accuracy. The full range of products meets all of the
CircuitWorks® Products are compliant with IPC-7711 Rework of Electronic Assemblies, and ANSI/J-STD-001.